| Imaging System图像系统 |
| Camera相机 | Ultra-High Speed Line-Scan CCD Cameras (3 or 5 组) |
| X-ray Source X光管 | Microfocus tube 130 kV max (可选) |
| Imaging Resolution图像分辨率 | 10 μm, 15 μm, 20 μm, 25 μm (可选) |
| Inspection Method检测方式 | 2D, 2.5D, 3D Slicing, Planar CT (可选) |
| Motion Table & Control运动控制台 |
| X-Axis Control X轴控制 | High-precision ballscrew + AC-servo controller高精度滚珠丝杆和AC伺服驱动 |
| Y-Axis Control |
| Z-Axis Control |
| X-Y Axis Resolution X/Y轴分辨率 | 1 µm |
| Board Handling |
|
| Max PCB Size 最大PCB尺寸 | Standard: 610 x 660 mm |
| 2 Stages: 1200 x 660 mm |
| PCB Thickness PCB厚度 | 0.6-7 mm |
| Max PCB Weight PCB重量 | 12 kg |
| Top Clearance 最大间隙 | @ 25 μm: 50 mm |
| @ 20 μm: 50 mm |
| @ 15 μm: 30 mm |
| @ 10 μm*: 15 mm |
| * For confirming the specific technical requirements, please contact TRI’s sales representative |
| Bottom Clearance 底部间隙 | @ 25 μm: 55 mm |
| @ 20 μm: 70 mm |
| @ 15 μm: 70 mm |
| @ 10 μm: 70 mm |
| Edge Clearance 边缘间隙 | 3 mm or 5 mm |
| Conveyor Height 轨道高度 | 880 - 920 mm |
| * SMEMA Compatible |
| Inspection Functions检测功能 |
| Component 元件 | Missing 缺失 |
| Misalignment 偏移 |
| Tombstone 立碑 |
| Billboard |
| Tantalum Polarity 反向 |
| Rotation旋转 |
| Floating 浮高 |
| Solder 锡膏 | Insufficient/Excess Solder 少锡/多锡 |
| Bridging 桥连 |
| Open |
| Solder Ball 锡球 |
| Non-wetting |
| Void 无效 |
| Lifted Lead 翘脚 |
| Dimensions尺寸 |
| WxDxH 长宽高 | 2014 x 2000 x 1940 mm |
| Note: not including signal tower, height: 510 mm |
| Weight 重量 | 4750 kg |
| Power Requirement 电源 | 200 – 240 VAC, Three Phase, 50 / 60 Hz, 7 kVA. Optional: 346 – 416 VAC Three Phase Transformer |